Yes, we must have a reference sample to compare IV curve traces and perform fault isolation techniques on your failing parts.
First and foremost, clearly serialize your parts and identify your reference part. Secure and place them in an ESD safe box before shipment to us. We recommend FedEx, UPS or any carrier with tracking number.
Yes, we accept jobs from every county. We have customers in Europe, Canada, Isreal…
Yes! Receipt of an approved purchase order is necessary before we can deliver your results. We highly recommend a blanket or open purchase order for continuing work and long-term projects to avoid possible delays.
IC Failure Analysis Lab’s standard turnaround time is three to five business days from the received day at one of our labs. Expedited services are available, please call.
We need detailed description of failure mode, failing pin numbers, bonding diagram, pin list, pin out or net list plus any other information that could assist our FA analysts to identify root cause of each failure.
Our engineers have more than 50 years combined experience. We provide high quality exceptional and personalized service at lower cost than our North American and European counterparts. Our turnkey services can save up to 45% of your current FA and Reliability testing costs in North America.
Absolutely yes! We will provide a comprehensive final report with each job. Preliminary and interim reports are also available upon request.
Semiconductor Failure analysis (FA) is the process of determining how or why a semiconductor device has failed often performed as a series of steps known as FA techniques. Device failure is defined as any non-conformance of the device to its electrical and/or visual/mechanical specifications. Failure analysis is necessary in order to understand what caused the failure and how it can be prevented in the future.
Electrical failure can be either functional or parametric. Functional failure refers to the inability of a device to perform its intended function. Parametric failure refers to the inability of a device to meet the electrical specifications for a measurable characteristic (such as leakage current) that does not directly pertain to functionality. Thus, a parametric failure may be present even if the device is still functional or able to perform its intended function.
Failure Mode is a description of how a device is failing, usually in terms of how much it is deviating from the specification that it is failing, e.g., excessive supply current, excessive offset voltage, excessive bias current.
Failure Mechanism is the physical phenomenon behind the failure of a device, e.g., metal corrosion, electrostatic discharge, electrical overstress.
Root Cause is the first event or condition that triggered, whether directly or indirectly, the occurrence of the failure, e.g., improper equipment grounding that resulted in ESD damage, a system problem that caused the usage of an incorrect mask set.