Decapsulation involves the removal of mold compound from an Integrated Circuit (IC) via combination of either acid (wet) or laser.  The process exposes die surface for performing an internal visual inspection, photo emission inspection and / or delayering of a semiconductor.

Chemical (Wet /Acid) Decapsulation:

This is a process that uses Nitric or Sulfuric acid to remove mold compound from an IC.

Laser Ablation:

The laser ablation is a process that uses a laser beam to ablate mold compound from an IC. This is a precise operation that we can use to control the location and amount of ablation on a sample. We can use CAD specifications to automate the process to perform a selective ablation per predefined coordinates into the laser ablation machine.