The Best In
Failure Analysis & Reliability Testing
CONTACT US
The Best In
Failure Analysis & Reliability Testing
CONTACT US
The Best In
Failure Analysis & Reliability Testing
CONTACT US
The Best In
Failure Analysis & Reliability Testing
CONTACT US
The Best In
Failure Analysis & Reliability Testing
CONTACT US

IC Failure Analysis Lab

IC Failure Analysis Lab is a privately held company located in Orange County, California. IC Failure Analysis Lab’s personnel have decades of collective experience in micro analysis and process analysis. Hence, these experiences have enabled us to bring high quality and low cost Failure Analysis, Microsurgery, and Reliability testing services in semiconductors, microelectronics, automotive, medical devices, telecommunications, reverse engineering, electronics, aerospace, military, and computers to our customers. Our state-of-the-art equipment and breadth of skilled workers are unmatched in America. Our turnkey services can save up to 45% of your current FA and Reliability testing costs and reduce your cycle time.

Why do you need IC Failure Analysis Lab’s Services?

Electronics and technology have fulfilled our daily life today. Electronic products manufactured with advanced, reliable, and complex integrated circuits (ICs) and components. A component failure inside a product will cost the manufacturing companies millions of dollars in repairs cost, lower productivity, and lower confidence level among the end-users. Our failure analysis and reliability testing services will identify the root cause of failures upstream in the manufacturing processes and eliminate unnecessary costs and downtime in production lines.
IC Failure Analysis Lab’s experienced analysts and state-of-the-art equipment will eliminate unnecessary repair and downtime costs by providing on-time and accurate failure analysis reports.


IC FAILURE SERVICES

IC Failure Analysis Lab

Are you looking for a reputable and independent Failure Analysis Lab to identify the root cause of failures in your electronic products? Look no further; the IC Failure Analysis Lab is a one-stop full-house lab. The IC Failure Analysis Laboratory provides the most accurate, fastest, and lowest cost semiconductor failure analysis services. Our lab keeps the customers informed by providing interim reports throughout the analysis.

The following technics are non-destructive analyses that identify obvious anomalies in any electronics components. We use Optical microscopes (OM), 2D or 3D X-Ray, Scanning Acoustic Microscopy (SAM), and I-V Curve Tracer to access the condition of each sample.

By exposing the internal circuits of a sample, our analysts investigate customer-reported failures (s). The analyst decapsulates the sample and uses an OBRICH/EMMI photoemission microscope to find the emission sites (hot spots) on the die surface.

We use multiple equipment and techniques to find the root cause of the reported failure. The most common methods are Delayering / Parallel Lapping, Scanning Electron Microscopy (SEM), Cross Section, Energy-Dispersive X-Ray Spectroscopy (EDX), Focused Ion Beam (FIB), Secondary Ion Mass Spectrometry (SIMS), etc.

Atomic Force Microscopy (AFM Analysis).png

Atomic Force Microscopy (AFM Analysis)

Dye and Pry Analysis

Dye and Pry Analysis

PCB Failure Analysis

PCB Failure Analysis

IC Failure Analysis

IC Failure Analysis

PCB Cost Analysis

IC / Package / PCB Cost Analysis

PCB Reverse Engineering

IC / Package / PCB Reverse Engineering

Optical Profiler (OP)

Optical Profiler (OP)

Scanning Capacitance Microscopy

SCM (Scanning Capacitance Microscopy)

Transmission Electron Microscopy

TEM (Transmission Electron Microscopy)

Sample Reports


Why do you need IC Failure Analysis Lab’s Services?

Electronics and technology have fulfilled our daily life today. Electronic products manufactured with advanced, reliable, and complex integrated circuits (ICs) and components. A component failure inside a product will cost the manufacturing companies millions of dollars in repairs cost, lower productivity, and lower confidence level among the end-users. Our failure analysis and reliability testing services will identify the root cause of failures upstream in the manufacturing processes and eliminate unnecessary costs and downtime in production lines.

IC Failure Analysis Lab’s experienced analysts and state-of-the-art equipment will eliminate unnecessary repair and downtime costs by providing on-time and accurate failure analysis reports.

Our Clients

About Us

IC Failure Analysis Lab is a privately held company located in Orange County, California.

IC Failure Analysis Lab Services’ personnel have decades of collective experience in micro analysis and process analysis. These experiences have enabled us to bring high quality and low cost Failure Analysis, Microsurgery, and Reliability testing services to our customers. Our state-of-the-art equipment and breadth of skilled workers is unmatched in America and Asia.

IC Failure Analysis Lab was established with a help of two industry veterans in 2008 to help our clients to save money in their Failure Analysis and Reliability testing services by providing fast and high quality services at lower prices.

Our turnkey services can save up to 45% of your current FA and Reliability testing costs.

Confidentiality and Security
All work undertaken is handled with the strictest confidence. A written declaration of non-disclosure is part of our standard Terms and Conditions.

Our Promise

  • We promise to provide the best services and do our best to identify the root cause of failure.
  • We promise to keep you up to date with on-going status report.
  • We promise to offer you the best and lowest cost per analysis.
  • We promise to offer you the most competitive price.  If our quote is not within your budget, please let us know and we will work with you.

Our Clients

Industries

Aerospace Devices

Aerospace Devices

Automotive Devices

Automotive Devices

Internet of Things

Internet of Things

Medical Devices

Medical Devices

Microelectronics

Microelectronics

Reverse Engineering

Reverse Engineering

Semiconductors

Semiconductors

Telecommunications

Telecommunications

FAQ

Yes, we must have a reference sample to compare IV curve traces and perform fault isolation techniques on your failing parts.

 

First and foremost, clearly serialize your parts and identify your reference part. Secure and place them in an ESD safe box before shipment to us. We recommend FedEx, UPS or any carrier with tracking number.

Yes, we accept jobs from every county. We have customers in Europe, Canada, Isreal…

Yes! Receipt of an approved purchase order is necessary before we can deliver your results. We highly recommend a blanket or open purchase order for continuing work and long-term projects to avoid possible delays.

 

IC Failure Analysis Lab’s standard turnaround time is three to five business days from the received day at one of our labs. Expedited services are available, please call.
We need detailed description of failure mode, failing pin numbers, bonding diagram, pin list, pin out or net list plus any other information that could assist our FA analysts to identify root cause of each failure.
Our engineers have more than 50 years combined experience. We provide high quality exceptional and personalized service at lower cost than our North American and European counterparts. Our turnkey services can save up to 45% of your current FA and Reliability testing costs in North America.
Absolutely yes! We will provide a comprehensive final report with each job. Preliminary and interim reports are also available upon request.
Semiconductor Failure analysis (FA) is the process of determining how or why a semiconductor device has failed often performed as a series of steps known as FA techniques. Device failure is defined as any non-conformance of the device to its electrical and/or visual/mechanical specifications. Failure analysis is necessary in order to understand what caused the failure and how it can be prevented in the future.
Electrical failure can be either functional or parametric. Functional failure refers to the inability of a device to perform its intended function. Parametric failure refers to the inability of a device to meet the electrical specifications for a measurable characteristic (such as leakage current) that does not directly pertain to functionality. Thus, a parametric failure may be present even if the device is still functional or able to perform its intended function.
Failure Mode is a description of how a device is failing, usually in terms of how much it is deviating from the specification that it is failing, e.g., excessive supply current, excessive offset voltage, excessive bias current.
Failure Mechanism is the physical phenomenon behind the failure of a device, e.g., metal corrosion, electrostatic discharge, electrical over-stress.
Root Cause is the first event or condition that triggered, whether directly or indirectly, the occurrence of the failure, e.g., improper equipment grounding that resulted in ESD damage, a system problem that caused the usage of an incorrect mask set.

Contact Us


    General Questions :

    info@ICFailureAnalysis.com

    Contact Number :

    +1 (949) 329-0340

    Address :

    Bill & Ship To: 27555 Homestead Rd – Laguna Niguel, CA 92677-6602
    Lab (New Address): 3506 W Lake Center Dr – Santa Ana, CA 92704