The Best InFailure Analysis & Reliability Testing
CONTACT USThe Best InFailure Analysis & Reliability Testing
CONTACT USThe Best InFailure Analysis & Reliability Testing
CONTACT USThe Best InFailure Analysis & Reliability Testing
CONTACT USThe Best InFailure Analysis & Reliability Testing
CONTACT US
IC Failure Analysis Lab
IC Failure Analysis Lab is a privately held company located in Orange County, California. IC Failure Analysis Lab’s personnel have decades of collective experience in micro analysis and process analysis. Hence, these experiences have enabled us to bring high quality and low cost Failure Analysis, Microsurgery, and Reliability testing services in semiconductors, microelectronics, automotive, medical devices, telecommunications, reverse engineering, electronics, aerospace, military, and computers to our customers. Our state-of-the-art equipment and breadth of skilled workers are unmatched in America. Our turnkey services can save up to 45% of your current FA and Reliability testing costs and reduce your cycle time.
Why do you need IC Failure Analysis Lab’s Services?
Electronics and technology have fulfilled our daily life today. Electronic products manufactured with advanced, reliable, and complex integrated circuits (ICs) and components. A component failure inside a product will cost the manufacturing companies millions of dollars in repairs cost, lower productivity, and lower confidence level among the end-users. Our failure analysis and reliability testing services will identify the root cause of failures upstream in the manufacturing processes and eliminate unnecessary costs and downtime in production lines.
IC Failure Analysis Lab’s experienced analysts and state-of-the-art equipment will eliminate unnecessary repair and downtime costs by providing on-time and accurate failure analysis reports.
IC FAILURE ANALYSIS SERVICES
IC Failure Analysis Lab
Are you looking for a reputable and independent Failure Analysis Lab to identify the root cause of failures in your electronic products? Look no further; the IC Failure Analysis Lab is a one-stop full-house lab. The IC Failure Analysis Laboratory provides the most accurate, fastest, and lowest cost semiconductor failure analysis services. Our lab keeps the customers informed by providing interim reports throughout the analysis.
The following technics are non-destructive analyses that identify obvious anomalies in any electronics components. We use Optical microscopes (OM), 2D or 3D X-Ray, Scanning Acoustic Microscopy (SAM), and I-V Curve Tracer to access the condition of each sample.
OM (Optical Microscope)
Scanning Acoustic Microscopy (SAM)
X-Ray (2-D) Examination
I-V (Curve Trace) Measurement
By exposing the internal circuits of a sample, our analysts investigate customer-reported failures (s). The analyst decapsulates the sample and uses an OBRICH/EMMI photoemission microscope to find the emission sites (hot spots) on the die surface.
Chemical / Laser Decapsulation
Photo Emission Microscopy (EMMI / OBIRCH)
We use multiple equipment and techniques to find the root cause of the reported failure. The most common methods are Delayering / Parallel Lapping, Scanning Electron Microscopy (SEM), Cross Section, Energy-Dispersive X-Ray Spectroscopy (EDX), Focused Ion Beam (FIB), Secondary Ion Mass Spectrometry (SIMS), etc.
Delayering / Parallel Lapping
SEM (Scanning Electron Microscopy)
Counterfeit Component Authenticity
Cross Sectioning
EDX (Energy-Dispersive X-Ray Spectroscopy)
FIB (Focused Ion Beam) Precision Cutting
SIMS (Secondary Ion Mass Spectrometry)
X-Ray (3-D) Examination
Atomic Force Microscopy (AFM Analysis)
Dye and Pry Analysis
PCB Failure Analysis
IC Failure Analysis
IC / Package / PCB Cost Analysis
IC / Package / PCB Reverse Engineering
Optical Profiler (OP)
SCM (Scanning Capacitance Microscopy)
TEM (Transmission Electron Microscopy)
Sample Reports
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IC Failure Analysis Lab (Typical FA Process Flow Chart)
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IC Failure Analysis Lab (Sample Report – Comprehensive Analysis)
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IC Failure Analysis Lab (Sample Report – Counterfeit Analysis)
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IC Failure Analysis Lab (Sample Report – Reverse Engineering Competitive Analysis)
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Terms and Conditions
Our Clients
About Us
IC Failure Analysis Lab is a privately held company located in Orange County, California.
IC Failure Analysis Lab Services’ personnel have decades of collective experience in micro analysis and process analysis. These experiences have enabled us to bring high quality and low cost Failure Analysis, Microsurgery, and Reliability testing services to our customers. Our state-of-the-art equipment and breadth of skilled workers is unmatched in America and Asia.
IC Failure Analysis Lab was established with a help of two industry veterans in 2008 to help our clients to save money in their Failure Analysis and Reliability testing services by providing fast and high quality services at lower prices.
Our turnkey services can save up to 45% of your current FA and Reliability testing costs.
Confidentiality and Security
All work undertaken is handled with the strictest confidence. A written declaration of non-disclosure is part of our standard Terms and Conditions.
Our Promise
- We promise to provide the best services and do our best to identify the root cause of failure.
- We promise to keep you up to date with on-going status report.
- We promise to offer you the best and lowest cost per analysis.
- We promise to offer you the most competitive price. If our quote is not within your budget, please let us know and we will work with you.
Our Clients
Industries
Aerospace Devices
Automotive Devices
Internet of Things
Medical Devices
Microelectronics
Reverse Engineering
Semiconductors
Telecommunications
FAQ
Do I need to include a reference (good) sample with failing parts?
Yes, we must have a reference sample to compare IV curve traces and perform fault isolation techniques on your failing parts.
How do I prepare my samples for shipment?
First and foremost, clearly serialize your parts and identify your reference part. Secure and place them in an ESD safe box before shipment to us. We recommend FedEx, UPS or any carrier with tracking number.
Does IC Failure Analysis Accept Jobs from other countries?
Yes, we accept jobs from every county. We have customers in Europe, Canada, Isreal…
Does IC Failure Analysis Lab accept Purchase Order (PO)?
Yes! Receipt of an approved purchase order is necessary before we can deliver your results. We highly recommend a blanket or open purchase order for continuing work and long-term projects to avoid possible delays.
What is Failure Analysis Lab’s turnaround time?
IC Failure Analysis Lab’s standard turnaround time is three to five business days from the received day at one of our labs. Expedited services are available, please call.
What document or information do I need to include with my samples?
We need detailed description of failure mode, failing pin numbers, bonding diagram, pin list, pin out or net list plus any other information that could assist our FA analysts to identify root cause of each failure.
How does IC Failure Analysis Lab compare to other FA labs?
Our engineers have more than 50 years combined experience. We provide high quality exceptional and personalized service at lower cost than our North American and European counterparts. Our turnkey services can save up to 45% of your current FA and Reliability testing costs in North America.
Does IC Failure Analysis Lab provide a report?
Absolutely yes! We will provide a comprehensive final report with each job. Preliminary and interim reports are also available upon request.
What is Semiconductor Failure Analysis?
Semiconductor Failure analysis (FA) is the process of determining how or why a semiconductor device has failed often performed as a series of steps known as FA techniques. Device failure is defined as any non-conformance of the device to its electrical and/or visual/mechanical specifications. Failure analysis is necessary in order to understand what caused the failure and how it can be prevented in the future.
Electrical failure can be either functional or parametric. Functional failure refers to the inability of a device to perform its intended function. Parametric failure refers to the inability of a device to meet the electrical specifications for a measurable characteristic (such as leakage current) that does not directly pertain to functionality. Thus, a parametric failure may be present even if the device is still functional or able to perform its intended function.
What is a Failure Mode?
Failure Mode is a description of how a device is failing, usually in terms of how much it is deviating from the specification that it is failing, e.g., excessive supply current, excessive offset voltage, excessive bias current.
What is Failure Mechanism?
Failure Mechanism is the physical phenomenon behind the failure of a device, e.g., metal corrosion, electrostatic discharge, electrical over-stress.
What is Root Cause?
Root Cause is the first event or condition that triggered, whether directly or indirectly, the occurrence of the failure, e.g., improper equipment grounding that resulted in ESD damage, a system problem that caused the usage of an incorrect mask set.
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Bill & Ship To: 27555 Homestead Rd – Laguna Niguel, CA 92677-6602
Lab (New Address): 3506 W Lake Center Dr, Suite D – Santa Ana, CA 92704
