SAM / SAT is a non-invasive & non-destructive failure analysis technique that inspects for voids, cracks, delaminations in a sample. SAM sends a focused sound wave through the package and interprets the change of the sound wave with the package.
Also read : electron microscope services
SAM is a superior tool to detect delaminations of sub-micron (down to 100nm) thicknesses. SAM can also measure thickness of an internal layer of s specimen. Scanning acoustic microscopy has many modes. The following are the most common modes used in failure analysis of an IC.
i-v curve analysis • ic decapsulation service • Counterfeit Component Authenticity • Cross Section Analysis • Parallel Lapping • Energy Dispersive X-Ray Spectroscopy • Focused Ion Beam • optical microscopy failure analysis • Photoemission microscopy failure analysis • electron microscope services • Secondary Ion Mass Spectrometry • IC X-Ray services
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